Quality, Promise and Value are the key of our success. If you are looking for a business partner supplying super quality products, welcome to contact EARLYSUN
New Chip Technology: Thermal resistance as low as 0.03 degree per watt.
Gold Wire: No gold wire; Led failure rate drop 90%; High stability.
High Thermal Conductivity; Low Thermal Resistance, Small Luminous Area: High luminous intensity; Convenient for optical design with high central luminous flux.
Patented Phosphor Technology: Stable color temperature, no floating.
Equipped with Temperature Sensor: More accurate heat dissipation and temperature control.
Simple Installation Design: Easy to use.
Anti-dust design for the luminous surface: Easy to keep the surface cleanD packaging materials.
Flip Chip Technology! New! ( 3W 7W 10W 20W)
Evolutional Launch!
Advanced in the world, First in China
Shenzhen Earlysun technology Co., Ltd., founded in 2004 in shenzhen nanshan district, a registered capital of 10 million yuan, Earlysun is an innovative new materials technology and product development company, committed to cost-effective and environmentally friendly LED encapsulation materials, solder paste packaging materials, adhesive colloid encapsulation materials and other fine chemical materials development and production, is China's power semiconductor and integrated semiconductor packaging solder national innovative enterprise leader and LED packaging materials.
